发明名称 |
SUBSTRATE TREATMENT APPARATUS, SUBSTRATE TREATMENT METHOD, AND METHOD FOR MANUFACTURING SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To suppress a poor influence such as spilling in a developing fluid caused by the influence of a down-flow whose temperature and humidity are controlled in paddle type development. SOLUTION: A substrate treatment apparatus comprises a mechanism 32 for rotatably retaining a substrate W to be treated; a first surrounding body 60 and a second surrounding body 75 for surrounding the substrate W to be treated retained by the substrate retaining mechanism 32; and a developing fluid supply mechanism 90 that travels in parallel with the substrate W to be treated retained by the substrate retaining mechanism 32 from the upper position of the first surrounding body 60 and supplies a developing fluid to the substrate W to be treated. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2005340845(A) |
申请公布日期 |
2005.12.08 |
申请号 |
JP20050177098 |
申请日期 |
2005.06.17 |
申请人 |
ITO YOSHITAKE |
发明人 |
ITO YOSHITAKE |
分类号 |
H01L21/027;(IPC1-7):H01L21/027 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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