发明名称 |
Surface-mount chip-scale package |
摘要 |
A chip-scale package and method of manufacturing a chip-scale package are provided. The chip-scale package includes a mounting portion defined by a plurality of metal layers formed on each of a plurality of semiconductor regions for mounting a device thereto. The mounting portions are formed on a first side of the plurality of semiconductor regions. The chip-scale package further includes a backside metal surface formed on each of a second side of the plurality of semiconductor regions, with the plurality of semiconductor regions providing electrical connection between the mounting portions and the backside metal surfaces. |
申请公布号 |
US2005269695(A1) |
申请公布日期 |
2005.12.08 |
申请号 |
US20040862710 |
申请日期 |
2004.06.07 |
申请人 |
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发明人 |
BROGLE JAMES J.;BOLES TIMOTHY E.;GOODRICH JOEL L. |
分类号 |
H01L23/14;H01L25/065;H01L25/07;H01L25/18;H01L27/02;H01L27/08;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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