| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic part mounting substrate that can realize lower inductance even if electronic parts are provided among a plurality of stuck electric circuits. <P>SOLUTION: A first electric circuit 1 having a plurality of via hole conductors 1b used for a power supply circuit 1bb and a ground circuit 1bc, and a second electric circuit 3 mounted on the first electric circuit 1, are connected by a plurality of connection terminals 5 formed on the via hole conductors 1b, and an electronic part 7 is provided in a form as bridging the connection terminals 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
