| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can securely connect an electrode of an electronic part to a solder joint pad. SOLUTION: The wiring board includes an insulating substrate 1 having a wiring conductor 2 at least at an internal part or on a surface, a solder joint pad 3 including copper having a step between the central part and the periphery of the top face such that the periphery is lower than the central part, a solder resist resin layer 4 formed in close contact with the side surface of the solder-joint pad 3 and the periphery without extending to the central part, and an electrolytic nickel plating layer 5 and a gold plating layer 6 sequentially deposited on the central part. COPYRIGHT: (C)2006,JPO&NCIPI
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