发明名称 Mikro Relais und Verfahren zu seiner Herstellung
摘要 A thin plate-shaped substrate 21 comprised of a monocrystal is provided with a piezoelectric element 24, and both ends of a movable piece 20 whose one surface is provided with a movable contact 25 are fixed and supported to a base 11. Then, by curving the movable piece 20 via the piezoelectric element 24, the movable contact 25 is brought in and out of contact with a pair of fixed contacts 38 and 39 that face the movable contact. With this arrangement, a subminiature micro-relay having a mechanical contact mechanism that has a small resistance in turning on the contact and the desired vibration resistance, frequency characteristic and insulating property can be obtained.
申请公布号 DE69734537(D1) 申请公布日期 2005.12.08
申请号 DE1997634537 申请日期 1997.08.26
申请人 OMRON CORP., KYOTO 发明人 SAKATA, MINORU;NAKAJIMA, TAKUYA;SEKI, TOMONORI;FUJIWARA, TERUHIKO;TAKEUCHI, MASASHI
分类号 B81B7/00;H01H1/00;H01H1/20;H01H9/52;H01H57/00;H01H59/00;H01H61/02;H01H67/22;H02N2/00;(IPC1-7):H01H1/00 主分类号 B81B7/00
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