| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment device capable of suppressing the adhesion of treatment liquid mist to a substrate top. SOLUTION: The substrate treatment device is provided with: a spin chuck 3 for holding and rotating a wafer 2; a chemical blast nozzle 5 for supplying a treatment liquid to the wafer 2 top; a treatment cup 1 arranged so that the side and the lower part of the wafer 2 may be surrounded; and a plurality of steps of cut structures 4 arranged in the inner wall of the treatment cup 1 in parallel to the oblique direction to the wafer 2. The plurality of steps of cut structures 4 can be spirally formed in the inner wall of a container. COPYRIGHT: (C)2006,JPO&NCIPI |
