发明名称 METHOD AND DEVICE FOR DETECTING DEFECT IN THROUGH HOLE
摘要 PROBLEM TO BE SOLVED: To provide a method and device for detecting a defect in a through hole capable of detecting surely quality of the through hole, as to the method and the device for detecting the defect in the through hole. SOLUTION: This method/device is provided with a heating means 20 capable of heating an inside of the through hole 4 provided in a printed circuit board 1, and a resistance measuring means 22 for measuring a resistance between both ends of the through hole 4 heated by the heating means 20. The quality of the through hole is measured by this manner, since it is known that a defective part inside the through hole is disconnected or gets highly resistive when the through hole is heated for a prescribed time. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005337900(A) 申请公布日期 2005.12.08
申请号 JP20040157421 申请日期 2004.05.27
申请人 FUJITSU LTD 发明人 YAMADA TETSUO
分类号 G01R31/02;H05K3/00;(IPC1-7):G01R31/02 主分类号 G01R31/02
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