| 摘要 |
<P>PROBLEM TO BE SOLVED: To mount a chip whose pads are located on one side on a lead frame and to connect the pads and inner leads with bonding wires without a trouble in a resin-sealed semiconductor device. <P>SOLUTION: In the semiconductor device where the chip 10 equipped with the group of bonding pads 13 located on one side is mounted on the lead frame 11 and is sealed with a resin 15, the lead frame has a group of pairs of inner leads 11a, 11b, and the chip is mounted on the group of the longer inner leads 11b through an insulating adhesive 12 on the back. The group of the shorter inner leads 11a, on which the chip is not mounted, and the bonding pads on the chip are connected through the bonding wires 141, and the tips of the group of the longer inner leads 11b and the bonding pads on the chip are connected through the bonding wires 142, and they are sealed with a resin. A portion, which is a part of the lead frame and continues to the group of pairs of the inner leads, extrudes from a pair of opposite sides of the package as a group of pairs of outer leads 11c, 11d, and its tips are outer terminals. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
