SURFACE-TREATED INORGANIC FILLER, EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a surface-treated inorganic filler which, through the surface treatment of an inorganic filler with a specific compound, attains the low viscosity by the enhanced affinity with the resin interface and effectively produces the improvement in adhesion between the base material and the cured product; to provide an epoxy resin composition for semiconductor encapsulation containing this; and to provide a semiconductor device formed by bonding and/or encapusulating a semiconductor element using this composition. SOLUTION: The surface-treated inorganic filler is the one wherein an inorganic filler is surface-treated with a compound containing at least one alkoxysilyl group and having two or more phenylene skeletons in one molecule. The surface-treated inorganic filler gives good fluidity even if highly loaded into a resin composition such as an epoxy resin composition, causing no disadvantages such as making the resin composition highly viscous, and has excellent adhesive properties. COPYRIGHT: (C)2006,JPO&NCIPI