发明名称 BLASTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a device recovering CO<SB>2</SB>and machined chips at a high recovery rate without leaving machined chips after machining, in a CO<SB>2</SB>blasting device. SOLUTION: A nozzle part and a recovery part of CO<SB>2</SB>and machined chips are formed in chamber structure, and a bottom face of a blade section surrounding in frame shape an opening part, facing a machined surface, of the chamber structure, is sealed while maintaining a micro clearance with clearance constant control by the feedback of a non-contact displacement sensor. The flow direction of a CO<SB>2</SB>blast collision jet is changed upward by the blade section. The internal pressure of a hole formed in the blade part to lead into the chamber from the machined surface is made negative by the dynamic pressure of the collision jet flowing on the upper face of the blade section. Further, the machined chips left on the machined surface are positively blown off by a blow nozzle and sucked. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005334979(A) 申请公布日期 2005.12.08
申请号 JP20040152692 申请日期 2004.05.24
申请人 HITACHI INDUSTRIES CO LTD 发明人 TAKAHASHI KENICHI;KUDO TAKUJI
分类号 B24C1/00;B24C5/04;H01J9/02;H01J11/22;H01J11/34;H01J11/36;(IPC1-7):B24C1/00 主分类号 B24C1/00
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