Microelectromechanical systems (MEMS) devices integrated in a hermetically sealed package

摘要

A package for a MEMS device includes a semiconductor cap structure and a lid substrate that define an encapsulated area within which the MEMS device is located. Feed-through metallization hermetically seals micro-vias in the semiconductor cap structure and extends through the semiconductor cap structure to provide interconnections coupled electrically to the MEMS device and to an exterior of the semiconductor cap structure.