发明名称 Electronic storage component, formed by producing a crystalline silicon wall and a polysilicon wall on a substrate, covering the walls, forming troughs, and applying an insulating layer
摘要 <p>A process for producing an electronic storage component circuit on a semiconductor, comprises forming a crystalline silicon wall (9) on a substrate (8), and a parallel polysilicon wall (10). The walls are covered with a cover material (19) and a primary trough (20) is formed between the walls. The trough is filled with a primary filling layer, and a second trough is formed and filled with a third material. The primary insulating layer forms a gate oxide.</p>
申请公布号 DE102004023985(A1) 申请公布日期 2005.12.08
申请号 DE20041023985 申请日期 2004.05.14
申请人 INFINEON TECHNOLOGIES AG 发明人 TEGEN, STEFAN;MUEMMLER, KLAUS
分类号 G11C8/14;H01L21/768;H01L21/8242;H01L27/108;(IPC1-7):H01L27/108 主分类号 G11C8/14
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