发明名称 |
Electronic storage component, formed by producing a crystalline silicon wall and a polysilicon wall on a substrate, covering the walls, forming troughs, and applying an insulating layer |
摘要 |
<p>A process for producing an electronic storage component circuit on a semiconductor, comprises forming a crystalline silicon wall (9) on a substrate (8), and a parallel polysilicon wall (10). The walls are covered with a cover material (19) and a primary trough (20) is formed between the walls. The trough is filled with a primary filling layer, and a second trough is formed and filled with a third material. The primary insulating layer forms a gate oxide.</p> |
申请公布号 |
DE102004023985(A1) |
申请公布日期 |
2005.12.08 |
申请号 |
DE20041023985 |
申请日期 |
2004.05.14 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
TEGEN, STEFAN;MUEMMLER, KLAUS |
分类号 |
G11C8/14;H01L21/768;H01L21/8242;H01L27/108;(IPC1-7):H01L27/108 |
主分类号 |
G11C8/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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