发明名称 WATER SOLUBLE RESIN COMPOSITION, METHOD OF PATTERN FORMATION AND METHOD OF INSPECTING RESIST PATTERN
摘要 A water soluble resin composition comprising at least a water soluble resin, an acid generator capable of generating an acid when heated and a solvent containing water. This water soluble resin composition is applied onto highly water repellent resist pattern (3), the resist pattern (3) formed from, for example, an ArF responsive radiation-sensitive resin composition, thereby providing coating layer (4). Thereafter, by heating, developer-insoluble modified layer (5) is formed on the surface of resist pattern (3). By developing the coating layer (4), there results a resist pattern thickened by the modified layer (5). This modified layer can be formed with not only a satisfactory thickness but also a favorable dimension controlling capability with respect to the resist pattern from ArF responsive radiation-sensitive resin composition. As a result, the resist pattern spacing size and hole opening size can be effectively reduced to limiting resolution or below. Further, this modified layer (5) also acts as a protective film for resist pattern when irradiated with electron beams, so that at the irradiation with electron beams of length measuring SEM, measured length variations for the resist pattern can be prevented.
申请公布号 KR20050115866(A) 申请公布日期 2005.12.08
申请号 KR20057015498 申请日期 2004.02.16
申请人 AZ ELECTRONIC MATERIALS (JAPAN) K.K. 发明人 TAKANO YUSUKE;HONG, SUNG EUN
分类号 G03F7/033;C08L39/00;G03F7/40;H01L21/027;(IPC1-7):G03F7/40 主分类号 G03F7/033
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