PEELING DEVICE FOR ISOLATING CHIP

摘要

PROBLEM TO BE SOLVED: To look for a device and a method effective for peeling a semiconductor chip off from adhesive tape while reducing the risk of the crack and the destruction of a chip for a larger or thinner chip, and to provide the device and the method of structures simpler than those of a prior art in order to isolate the larger or thinner chip efficiently. SOLUTION: There is provided a peeling device for isolating the chip from an adhesive tape to which a chip is adhered. The device comprises a platform including a first surface and a contact surface in a one-step higher state provided at a predetermined height relative to the first surface. The contact surface in the one-step higher state has a width smaller than the width of the chip in order to be in contact with the adhesive tape at the position of the chip. Further, an elevator device can project from the contact surface in the higher state. The elevator device can move relative to the platform for isolating the chip from the adhesive tape and elevating the chip. COPYRIGHT: (C)2006,JPO&NCIPI