| 摘要 |
PROBLEM TO BE SOLVED: To provide a heating device capable of preventing a warp by high rigidity, having high thermal conductivity of a processed object mounting surface, improving a soaking property, and cooling rapidly. SOLUTION: The heating device comprises a mounting part for mounting a processed object, a heating part having a resistance heating element for heating the mounting part, and a supporting part for supporting the mounting part and heating part. Young's moduli of the mounting part and the supporting part are equal to or more than 100 GPa respectively. Since the Young's moduli are equal to or more than 100 GPa, deformation in pressing a probe card can be reduced even when a thickness of the mounting part is small. COPYRIGHT: (C)2006,JPO&NCIPI |
