发明名称 MULTILAYER PRINTED SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed substrate on which an inductor formed of wiring is arranged effectively so as not to deteriorate transmission quality. <P>SOLUTION: The multilayer printed substrate is provided with the inductor formed thereon. In this case, the inductor comprises coil wiring and a first via hole separated from the coil wiring, and a metal film is formed on the inner wall thereof, so that an induced current is made to flow through the metal film by a high-frequency current which flows through the coil wiring. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2005340577(A) 申请公布日期 2005.12.08
申请号 JP20040158887 申请日期 2004.05.28
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HAMADA SEIJI;FUSAYASU KOJI;MIMURA SHIYOUICHI;NYURAIIN MIYOKO;MATSUBARA AKIRA
分类号 H05K1/16;H01L23/12;H05K1/11;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/16
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