| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device by which a high-quality, high-reliability, and inexpensive printed wiring board can be manufactured. SOLUTION: The printed wiring board manufactured by the method is provided with a substrate (1), wiring patterns (3) respectively formed on both surface sides of the substrate (1), and a conductive through hole (1a) used for electrically connecting the wiring patterns (3) to each other. The printed wiring board is also provided with a filler (4) packed in the through hole (1a) and an insulating layer (9) which is formed in contact with the filler (4) to cover at least one surface side of the substrate (1). The method includes a packing step of packing first ink (4) having a thermosetting property in the through hole (1a), an insulating layer applying step of applying second ink (9) also having a thermosetting property to at least one surface side of the substrate (1) so that the ink (9) may come into contact with the first ink (4), and a curing step of simultaneously thermosetting the first and second ink (4) and (9). COPYRIGHT: (C)2006,JPO&NCIPI
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