发明名称 COPPER FOIL FOR PRINTED WIRING BOARD AND ITS PRODUCTION PROCESS
摘要 PROBLEM TO BE SOLVED: To provide a copper foil containing no hexavalent chromium nor fluorine ion imposing high environmental burden and having a chromate film of trivalent chromium where environmental protection is taken into account for use in a printed wiring board, and to provide its production process. SOLUTION: After a zinc plating film of 3-100μg/cm<SP>2</SP>is applied onto the surface of a copper foil subjected to roughing, the copper foil is immersed into aqueous solution not containing hexavalent chromium nor fluorine ion but containing trivalent chromium ions by 0.11-0.50 mg/L as metal chromium, and nitric acid by 0.20-0.51 g/L thus performing trivalent chromium conversion treatment. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005340633(A) 申请公布日期 2005.12.08
申请号 JP20040159549 申请日期 2004.05.28
申请人 HITACHI CABLE LTD 发明人 ITO YASUYUKI;MATSUMOTO YUKO;YOKOMIZO KENJI;SASAKI HAJIME
分类号 H05K1/09;(IPC1-7):H05K1/09 主分类号 H05K1/09
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