ULTRASONIC CLEANING FOR WAFER

摘要

PROBLEM TO BE SOLVED: To solve a problem in plating for a semiconductor wafer that a part having a foreign matter such as a resist or dirt remaining on the wafer owing to insufficient cleaning is not plated by electroless plating treatment. SOLUTION: Because all the foreign matters are not removed only by immersion cleaning with a degreasing liquid, this cleaning method applies ultrasonic vibration to the degreasing liquid to remove the foreign matters on the wafer. COPYRIGHT: (C)2006,JPO&NCIPI