发明名称 CAULK-LAMINATING DIE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a caulk-laminating die device in which caulk-lamination of a lamination piece contour-punched to a predetermined shape by using a punch and a die out of a thin metal plate with a projection/recess for caulking formed in advance and a lamination piece contour-punched and held inside the die are caulk-laminated to each other without any defective caulking from the beginning of the contour-punching/caulk-lamination of the lamination piece even when the lamination piece is thin. SOLUTION: The caulk-laminating die device comprises a supporting means which has a supporting base in an advancing manner into a die in an elevating/lowering manner and supports a previously contour-punched lamination piece and supports the back pressure when the lamination piece is contour-punched out of a thin metal plate and caulk-laminated, an electric motor which drives the supporting means, elevates/lowers the supporting base and stops the supporting base at the predetermined position, a pressure sensor which is provided on the supporting means, and detects the pressure from the lamination piece when contour-punching the lamination piece out of the thin metal plate and performing the caulk-lamination, and a control means to control the operation of the electric motor based on the detected value from the pressure sensor. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005334930(A) 申请公布日期 2005.12.08
申请号 JP20040156290 申请日期 2004.05.26
申请人 MITSUI HIGH TEC INC 发明人 OTANI MICHITOSHI
分类号 B21D28/02;B21D43/22;(IPC1-7):B21D28/02 主分类号 B21D28/02
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