METHOD AND DEVICE FOR ULTRASONIC BONDING

摘要

[PROBLEMS] To provide an ultrasonic bonding method capable of providing excellent bonding quality even when a member to be bonded with low mechanical strength is bonded by efficiently transmitting ultrasonic vibration to the member by applying members. [MEANS FOR SOLVING PROBLEMS] In this ultrasonic bonding method for bonding a part (P) to a substrate (B) by applying the ultrasonic vibration to the part (P), both side faces of the part (P) in the ultrasonic vibrating direction are held by the applying members (10) and (17) applying the specified ultrasonic vibration to the part (P) and a holding member (35). A contact part (35a) in contact with the applying member (17) and an elastic member (37) are installed on the holding member (35) and the part (P) is held by the flexional force of the elastic member (37). The holding member (35) is synchronously vibrated by the ultrasonic vibration transmitted from the applying members (10) and (17) thereto through the contact part (35a) to bond the part (P) to the substrate (B) with the part (P) pressed against the applying members (10) and (17).