HOLDING PART AND SUPPORTING PART OF WIRE BONDER

摘要

PROBLEM TO BE SOLVED: To enable loop formation on the free condition without collision of a capillary with a holding part even when a wire is long in a reverse bonding mode or when the set angle of the moving action of the wire in the direction of the periphery is nearly horizontal.

SOLUTION: A hollow part 47 is provided outside and adjacent to the pressing part 46 of the holding part 41 for pressing down the periphery of a semiconductor device to prevent the occurrence of the collision of the capillary with the holding part 41 even when the wire is long or when the set angle of the moving action of the wire in the direction of the periphery is nearly horizontal.

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