| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lamination device which does not come into contact unexpectedly with internal pressure bonding parts heated through a lamination processing. <P>SOLUTION: The lamination device is constituted of the pressure bonding parts 40 and 50 which thermally pressure-bonds a laminate material over a recording medium, internally fitted to enclosures 1A and 1B and forms a laminated layer on the recording surface of the recording medium. The enclosures 1A and 1B are structured in a freely opening/closing manner, and equipped with shielding bodies 160 and 161 which change their position so as to cover heating source constituent elements of the pressure bonding parts 40 and 50 following the opening of the enclosures 1A and 1B. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
