| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition having excellent sensitivity, resolution and residue removing property even when it is used in a short developing time, and giving a preferable cured relief pattern profile. <P>SOLUTION: The positive photosensitive resin composition comprises 100 parts by mass of hydroxyl polyamide expressed by general formula (1), 1 to 30 parts by mass of a specified phenol compound, and 1 to 100 parts by mass of a photosensitive diazoquinone compound. In formula (1), X<SB>1</SB>represents a tetravalent organic group having at least ≥2 carbon atoms, each of X<SB>2</SB>, Y<SB>1</SB>and Y<SB>2</SB>represents a bivalent organic group having at least ≥2 carbon atoms, m represents an integer 2 to 1,000, and n represents an integer 0 to 500 satisfying m/(m+n)>0.5. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
