| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a noncontact IC mounting body, which hardly causes peeling of each layer or each member by heat in cleaning or the like, solvent and mechanical force, and is also difficult to peel from an adherend itself as an adherend with noncontact IC mounting body. <P>SOLUTION: A fluidizable material represented by a filler 9 or the like, which constitutes or covers at least a part of the surface of a noncontact IC mounting body main body part 12, is penetrated and connected to a permeable base material 1. Therefore, by interposing the permeable base material, a thermally fusible adhesive layer 2 formed by penetrating to the permeable base material is firmly bonded to the noncontact IC mounting body main body part, and integrated as the noncontact IC mounting body. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
