| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a radio IC tag for making it difficult to peel resin for coating, and for making it easy to handle with a film for fixation by providing an internal IC chip with high thermal insulation properties and water preventing properties to an external environment without using any metal which becomes an obstacle to radio communication. <P>SOLUTION: At the time of manufacturing a radio IC tag where an IC chip 2 including an antenna for radio communication is coated with resin 3 for coating, a film 5 for fixation made of synthetic resin is prepared. This film 5 is preliminarily formed with a resin circulation hole 12 in the neighborhood of a fixation position 11 of the IC chip 2. The IC chip 2 is bonded to the fixation position 11 on the film 5. The film 5 is interposed between upper and lower metal molds 6 and 7, and the IC chip 2 on the film 5 is positioned and loaded in a coating formation space 20 of the upper and lower metal molds 6 and 7. Melting resin is injected into the coating formation space 20 of the upper and lower metal molds 6 and 7 so that the IC chip 2 can be covered. When the film 5 and the IC chip 2 are loaded in the coating formation space 20 of the upper and lower metal molds 6 and 7, a portion of the resin circulation hole 12 is positioned in the coating formation space 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
