| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the uniformity of the thickness of a deposition film and of the characteristics of the same by preventing the deformation of a long band-shaped member, the deformation being caused when it passes through the inside of a processing chamber and by stabilizing plasma discharge upon deposition film formation. <P>SOLUTION: A deposition film forming apparatus for performing processing while sequentially passing a substrate through the insides of a plurality of coupled processing chambers using a band-shaped member as the substrate to be processed, includes a process of applying a plastic deformation processing for raising flatness retention of the substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
