发明名称 SEMICONDUCTOR LASER DIODE PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor laser diode package in which a high power semiconductor laser diode having a long resonator length is applicable. SOLUTION: The semiconductor laser diode package comprises a stem 110 in which a through hole 110a is formed at a predetermined position; a heat sink 112 which is disposed around the through hole 110a to project from a surface of the stem 110; and a laser diode 115 mounted on the heat sink 112. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005340807(A) 申请公布日期 2005.12.08
申请号 JP20050144080 申请日期 2005.05.17
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 CHO SOO-HAENG
分类号 H01L23/02;H01L23/04;H01S3/04;H01S3/0941;H01S5/022;H01S5/024;H01S5/06;H01S5/10;(IPC1-7):H01S5/022 主分类号 H01L23/02
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