发明名称 |
SEMICONDUCTOR LASER DIODE PACKAGE |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser diode package in which a high power semiconductor laser diode having a long resonator length is applicable. SOLUTION: The semiconductor laser diode package comprises a stem 110 in which a through hole 110a is formed at a predetermined position; a heat sink 112 which is disposed around the through hole 110a to project from a surface of the stem 110; and a laser diode 115 mounted on the heat sink 112. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2005340807(A) |
申请公布日期 |
2005.12.08 |
申请号 |
JP20050144080 |
申请日期 |
2005.05.17 |
申请人 |
SAMSUNG ELECTRO MECH CO LTD |
发明人 |
CHO SOO-HAENG |
分类号 |
H01L23/02;H01L23/04;H01S3/04;H01S3/0941;H01S5/022;H01S5/024;H01S5/06;H01S5/10;(IPC1-7):H01S5/022 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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