摘要 |
PROBLEM TO BE SOLVED: To provide an etching liquid and an etching method contributing to the prevention of semiconductor wafer metal contamination, and to provide a semiconductor wafer with its metal contamination greatly reduced. SOLUTION: For the preparation of the etching liquid, metal ions contained in the etching liquid are non-ionized by conversion into a poorly soluble compound, and then the compound is removed. In this method, a semiconductor wafer is etched by using the etching liquid. The result is a semiconductor wafer greatly reduced in metal contamination. COPYRIGHT: (C)2006,JPO&NCIPI
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