发明名称 ETCHING LIQUID, ETCHING METHOD, AND SEMICONDUCTOR WAFER
摘要 PROBLEM TO BE SOLVED: To provide an etching liquid and an etching method contributing to the prevention of semiconductor wafer metal contamination, and to provide a semiconductor wafer with its metal contamination greatly reduced. SOLUTION: For the preparation of the etching liquid, metal ions contained in the etching liquid are non-ionized by conversion into a poorly soluble compound, and then the compound is removed. In this method, a semiconductor wafer is etched by using the etching liquid. The result is a semiconductor wafer greatly reduced in metal contamination. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005340649(A) 申请公布日期 2005.12.08
申请号 JP20040159781 申请日期 2004.05.28
申请人 SILTRONIC JAPAN CORP 发明人 MORI YOSHIHIRO;NISHIMURA SHIGEKI
分类号 C09K13/00;H01L21/306;(IPC1-7):H01L21/306 主分类号 C09K13/00
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