发明名称 MULTIPLE PATTERNING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a multiple patterning substrate wherein the distance from a splitting groove to a wiring conductor is formed in a prescribed distance. SOLUTION: The multiple patterning substrate 107 is provided with: a mother substrate 101 in which two or more wiring substrate regions 102 and dummy regions 103 are formed; a splitting groove 104 formed in the boundary of the wiring substrate region 102 fellows, and the boundary of the wiring substrate region 102 and the dummy regions 103; wiring conductor 105 formed so that it might extend in the direction of a center section and the direction of a rim (splitting groove 104 direction) of wiring substrate region 102, at the peripheral part in wiring substrate region 102; and an insulating layer 106 formed in the peripheral part in wiring substrate region 102. The insulating layer 106 is formed so that the end by the side of the rim of the wiring conductor 105 (splitting groove 104 side) may be covered. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005340562(A) 申请公布日期 2005.12.08
申请号 JP20040158734 申请日期 2004.05.28
申请人 KYOCERA CORP 发明人 KISHIYOSHI KAZUNORI
分类号 H05K3/28;H05K1/02;H05K3/00;(IPC1-7):H05K3/28 主分类号 H05K3/28
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