发明名称 MULTIPLE PATTERNING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board that can easily detect the presence of shortcircuiting in the multiple patterning layer of the wiring board where a plating layer is adhered to a wiring conductor or a penetrating conductor, in a state of the multiple patterning wiring board. SOLUTION: The multiple wiring board is provided with a mother board 1 wherein a square wiring board area 2 is arranged vertically and horizontally, penetrating conductors 7 formed over a border line 8 between the wiring board areas 2, and wiring for plating conduction formed across the border line 8 between the adjoining penetrating conductors 7 by which a plating layer is applied to the conductor layer of the penetrating conductor 7 by electrolytic plating method. The wiring for plating conduction is provided with first and second wirings 4a and 4b for plating conduction that are electrically independent to each other, and the penetrating conductors 7 are formed into a plurality of pieces along the side of wiring board area 2, while the wiring board areas 2 are alternately connected with the first and second wirings 4a and 4b for plating conduction. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005340538(A) 申请公布日期 2005.12.08
申请号 JP20040158450 申请日期 2004.05.27
申请人 KYOCERA CORP 发明人 KAJISA SADAMU
分类号 H05K1/02;H01L23/13;(IPC1-7):H05K1/02 主分类号 H05K1/02
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