| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed circuit board by which generation of dust at the time of processing the outer shape of the printed circuit board can be suppressed. SOLUTION: Inner layer copper foil 2 having an inner layer circuit pattern is formed on a core material 1 obtained by impregnating resin in glass cloth, a slit 8 is formed on a boundary area between a product area 5 and a peripheral area 6, an insulating layer 3 is formed around the inner layer copper foil by molding press, the slit 8 is filled with the insulating layer, and after forming outer layer copper foil 4 having an outer layer circuit pattern on the insulating layer 3, the product area 5 and the peripheral area 6 are divided from the boundary area so that the insulating layer 3 filled in the slit is left in the product area 5 and the peripheral area 6. COPYRIGHT: (C)2006,JPO&NCIPI
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