发明名称 WIRING BOARD AND ITS MANUFACTURING PROCESS, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING PROCESS, ELECTRONIC DEVICE AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To enhance reliability of a wiring board, or the like. SOLUTION: The wiring board comprises a flexible board 10 having an area 12 for mounting a chip component, and a wiring pattern having wiring 20. The wiring 20 has a first section 24 including an electric joint 22 formed on the inside of the chip component mounting area 12 and extended with the width of the electric joint 22, a second section 26 formed on the side opposite to the first section 24 of the flexible board 10, and a through hole 28 penetrating the flexible board 10 to connect the first section 24 electrically with the second section 26. The first section 24 is formed not to extend to the outside of the chip component mounting area 12, the through hole 28 is formed on the inside of the chip component mounting area 12, and the wiring 20 is extended to the outside of the chip component mounting area 12 through the second section 26. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005340294(A) 申请公布日期 2005.12.08
申请号 JP20040153653 申请日期 2004.05.24
申请人 SEIKO EPSON CORP 发明人 KOMUKAI NAOKI
分类号 H01L23/12;(IPC1-7):H01L23/12 主分类号 H01L23/12
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