| 摘要 |
A printed circuit board with at least one shielded path placed on an outer layer of the board is provided with a shield composed of SMD elements ( 215 ) and shielding paths and/or planes, placed at both sides along the shielded path. The shielding paths or planes ( 213, 214 ) are connected to the ground, and the SMD elements ( 215 ) create a line of SMD elements, which are placed over the shielded path ( 212 ), and whose contacts, ( 216, 217 ) extending beyond the shielded path ( 212 ), are connected with the shielding paths or planes ( 213, 214 ), placed at both sides of the shielded path ( 212 ).
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