发明名称 Wired circuit board and connection structure of wired circuit board
摘要 In order to provide a wired circuit board in which electrical continuity inspection can be omitted and a connection structure of the wired circuit board, in connection between a first wired circuit board 1 and a second wired circuit board 2 , a first connection terminal 13 and a second connection terminal 14 are abutted against each other in the direction in which they are opposed along the respective longitudinal direction of the wired circuit boards, and are arranged in line with each other, and a solder bump 15 is provided so as to continuously extend over surfaces of the first connection terminal 13 and the second connection terminal 14 . Consequently, the solder bump 15 is not interposed between opposed surfaces of the first connection terminal 13 and the second connection terminal 14 , thereby allowing electrical connection by the solder bump 15 between the first connection terminal 13 and the second connection terminal 14 to be confirmed from the appearance by visual observation.
申请公布号 US2005272276(A1) 申请公布日期 2005.12.08
申请号 US20050135511 申请日期 2005.05.24
申请人 NITTO DENKO CORPORATION 发明人 OOYABU YASUNARI
分类号 H05K1/11;H01R33/00;H05K1/14;H05K3/00;H05K3/36;(IPC1-7):H01R33/00 主分类号 H05K1/11
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