| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can provide higher capacity and realizes reduction in size and thickness and also provide a mounting substrate thereof. <P>SOLUTION: In a resin-sealing type semiconductor device using leads for external connection, a single surface of lead is covered with resin, a part of the opposite surface of the lead is exposed, and the exposed lead is recessed in comparison with the other part of the opposite surface of the semiconductor device. This semiconductor device is provided on a substrate with the part where the lead is exposed is placed in the upper side and the part where the lead is exposed is electrically connected with the substrate with a wire. Or, the semiconductor device is provided on the substrate with the part where the lead is exposed is placed in the lower side and the part where the lead is exposed is electrically connected with the substrate using solder. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
