| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board suitable for a mounted circuit device for easily forming a plated layer for enabling highly reliable bonding, and for executing fine wiring patterning. SOLUTION: This method for manufacturing a wiring board comprises a process to carry out the pattern etching of the first face side conductive region of a conductive sheet 8, and to form a projecting conductive part including a plurality of independent wiring layers 9, 10, 11a and 11b of a wiring board on the second face side conductive region; a process to laminate the projecting conductive part of the conductive sheet oppositely to an insulating layer, and to embed and integrate the projecting conductive part in an insulating layer; a process to remove the second face side conductive layer by etching while a band-shaped plated electrode is made to remain for commonly connecting the independent wiring layers; a process to coat an insulating layer for plating so that the region to be plated can be exposed; a process to plate the region to be plated; and a process to remove the band-shaped plate electrode part, and to electrically separate the independent wiring layers. COPYRIGHT: (C)2006,JPO&NCIPI
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