EXTERNAL PALLADIUM PLATING STRUCTURE OF SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

In an external plating structure of a semiconductor package, a Pd or Pd alloy film is used as a material replacing the conventional solder plating as a soldering metal. The highly reliable semiconductor component external plating structure is provided without causing problems, such as short-circuiting, due to whiskers, etc. between terminals. In the external plating structure, on the surfaces of the external connecting terminals (10, 12) of the semiconductor component using copper or copper alloy material, Pd or Pd alloy (26) is used, replacing the conventional solder plating as a soldering metal. In the case of forming a plating film having a thickness of 0.3mum or less, plating is performed between the material and the plated Pd or Pd alloy layer, without having a base layer or an intermediate metal layer in between. On the plating film, depending on a case, an Au or Au alloy plating (28) having a thickness of 0.1mum or less is further formed.