发明名称 |
WAFER-PITCH CONVERTING MACHINE |
摘要 |
PROBLEM TO BE SOLVED: To provide at a low cost a wafer-pitch converting machine whereby a pitch interval between semiconductor wafers can be altered rapidly and the control of the dimensional accuracy of the pitch interval is made easy. SOLUTION: The wafer-pitch converting machine has a plurality of wafer holding members for holding a plurality of wafers nearly in parallel with one another and has supporting bodies for supporting in a slidable way the wafer holding members. Each wafer holding member so has an engaging recessed portion for coupling it to an adjacent wafer holding member disposed on its one end side and so has an engaging protruding portion for coupling it to an adjacent wafer holding member disposed on its other end side as to couple the wafer holding members to each other by engaging female claws disposed on the side surface of the engaging recessed portion with male claws disposed on the side surface of the engaging protruding portion. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2005340729(A) |
申请公布日期 |
2005.12.08 |
申请号 |
JP20040161111 |
申请日期 |
2004.05.31 |
申请人 |
TOKYO KOGYO BOYEKI SHOKAI LTD |
发明人 |
KURUMIYA MORIYUKI;KITAI MASATO |
分类号 |
H01L21/677;H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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