发明名称 METHOD OF PROCESSING CHUCK TABLE IN PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a method of processing a chuck table in a processing apparatus wherein a distance between the holding surface of the chuck table and a cutting tool can be unified over the entire region of the holding surface. SOLUTION: The processing apparatus comprises the chuck table having the holding surface for holding a plate-like object, a chuck table moving mechanism for moving the chuck table, a cutting unit containing the cutting tool for cutting and truing up heights of a plurality of electrodes formed in a projecting state on the surface of a plate-like object held by the chuck table, and a cutting unit feeding mechanism for making back and forth the movement of the cutting unit in a direction perpendicular to the holding surface of the chuck table. In processing the chuck table in the processing apparatus, the chuck table is moved to a processing area, and then the holding surface of the chuck table is cut by the cutting unit. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005340324(A) 申请公布日期 2005.12.08
申请号 JP20040154199 申请日期 2004.05.25
申请人 DISCO ABRASIVE SYST LTD 发明人 NAMIOKA SHINICHI
分类号 B23C3/00;H01L21/60;(IPC1-7):H01L21/60 主分类号 B23C3/00
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