| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device wherein an electric glitch due to disconnection or leakage and connection failure upon mounting can be reduced while using a conventional process and suppressing the influence of wiring characteristics. SOLUTION: This semiconductor device is highly reliable and capable of reducing the electric glitch due to disconnection or leakage and connection failure upon mounting while using the conventional process and suppressing the influence of the wiring characteristics, by increasing the size, thickness, or number of plating stubs 7, or inserting vias between the plating stubs 7 and reinforcing the stiffness of the plating stubs 7. COPYRIGHT: (C)2006,JPO&NCIPI |
