| 摘要 |
PROBLEM TO BE SOLVED: To improve the positional precision of bump terminals and isolated pad terminals in a sheet with a bump constituting a substrate for inspection (probe card). SOLUTION: The sheet 10 is formed with the bump consisting of a polyimide film 12, the plurality of bump terminals 15, and the plurality of isolated pad terminals 11a. Thereafter, the tension of the polyimide film 12 by a second rigid ring 14 is adjusted by a bump position correction tool 30, so that the position of each bump terminal 15 at the polyimide film 12 may match with a prescribed position. Subsequently, a first rigid ring 16 to be used originally is adhered to the inside of the second rigid ring 14 at the polyimide film 12 so as to hold the position of each bump terminal 15 corrected to the prescribed position. COPYRIGHT: (C)2006,JPO&NCIPI
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