发明名称 BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a bonding device wherein speeding-up is possible. SOLUTION: A driving mechanism 21 for turning a tool holder 13 and a load mechanism 22 for applying a load to the bonding tool 13 are provided to a bonding head 12. The drive source of the driving mechanism 21 is configured with a hollow motor 31, and the tool holder 14 is inserted to a hollow motor shaft 35 to guide the holder 14 freely for a vertical motion. A bracket 43 and the tool holder 14 fixed to the motor shaft 35 are coupled via a plate spring 63 to permit the rotation of the tool holder 14 and the vertical movement of the tool holder 14 in association with rotation of the motor shaft 35. The load mechanism 22 is provided with a voice coil motor 81, and a support unit 102 for freely turnably supporting the tool holder 14 is provided to a tip of an arm 101 extended from the rotor 93 of the voice coil motor 81. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005340411(A) 申请公布日期 2005.12.08
申请号 JP20040155612 申请日期 2004.05.26
申请人 NIDEC TOSOK CORP 发明人 NAKAYAMA DAISUKE
分类号 H01L21/60;H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/60
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