| 摘要 |
PROBLEM TO BE SOLVED: To provide a quality control method and a quality control system of a semiconductor product which can determine the source of the generation of defectives in a multi-chip module product with less amount of information. SOLUTION: The source of the generation of defectives can be determined by a quantificated result by reading die ID and defective information, mapping the good or fail result by the coordinate information included in the die ID for each product, and then quantificating the mapping result of each product. COPYRIGHT: (C)2006,JPO&NCIPI
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