发明名称 |
Color image sensor device and fabrication method thereof |
摘要 |
A Color image sensor device and fabrication method thereof. A passivation layer and a first planarization layer are sequentially formed on a substrate. A plurality of color filter elements are disposed over the first planarization layer corresponding to the sensor pixel array. A second planarization layer and a third planarization layer are sequentially formed over the first planarization layer. The third planarization layer has an opening formed corresponding to a contact pad. A third opening in the first planarization layer and the passivation layer corresponds to the contact pad.
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申请公布号 |
US2005269656(A1) |
申请公布日期 |
2005.12.08 |
申请号 |
US20040000935 |
申请日期 |
2004.12.02 |
申请人 |
POWERCHIP SEMINCONDUCTOR CORP. |
发明人 |
SHIAN-CHING TSAI;SIAN-MIN CHUNG;CHIA-CHIANG WANG;YU-WAN CHEN;SHIH-LAN CHEN;LEE FU Z. |
分类号 |
H01L21/00;H01L21/302;H01L27/146;H01L31/00;H01L31/0216;(IPC1-7):H01L31/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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