| 摘要 |
A cooling module is provided for use in an electronic device. The cooling module includes a heat conducting plate, a heat conducting pillar erected on the bottom surface of the heat conducting plate facing a heat generating electronic element, a cooling fin set disposed on the top surface of the heat conducting plate, and an wind mask covering the heat conducting plate and the cooling fin set. An air generator is disposed to one side of the wind mask, and an opening is formed at the other side of the wind mask. Furthermore, a fastening element is formed at two sides of the wind mask for fastening the cooling module onto the housing of the electronic device. Since the housing of the electronic device supports the weight of the cooling module, the heat generating electronic element is prevented from being damaged by the weight of the cooling module.
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