发明名称 Semiconductor device and manufacturing method for same
摘要 The thermal processing step of thermally processing a variable resistor film in an oxidizing atmosphere is carried out after the film formation step of forming a variable resistor film (PCMO film), and ON radicals are introduced into positions of oxygen deficiency defects in the PCMO film, and thereby, the three-dimensionally coupled network structure having the PCMO perovskite structure is locally broken down so as to increase the resistivity value.
申请公布号 US2005270821(A1) 申请公布日期 2005.12.08
申请号 US20050145217 申请日期 2005.06.06
申请人 SHARP KABUSHIKI KAISHA 发明人 NAKANO TAKASHI
分类号 H01L27/04;G11C11/22;H01L21/822;H01L27/10;H01L45/00;(IPC1-7):G11C11/22 主分类号 H01L27/04
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