| 摘要 |
<P>PROBLEM TO BE SOLVED: To facilitate the partial reinforcement of an external terminal. <P>SOLUTION: This method for manufacturing a semiconductor device comprises (a) a step for providing paste 26 containing resin on a joint 15 connected electrically with a semiconductor substrate 16, (b) a step for providing a solder material 28 above the electric joint 15 in contact with the paste 26, and (c) a step for melting the solder material 28 and the paste 26 to form an external terminal 30 from the solder material 28 and forming a reinforcing part 32 from the paste 26. The reinforcing part 32 exposes a part of the outer terminal 30 and covers the circumference of the proximal end of the external terminal 30 connected with the electric joint 15. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
