| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an abrasive compound capable of polishing in high speed while especially keeping the planarity of a metal film by suppressing etching and erosion, a polishing method of the metal film using the abrasive compound simultaneously, and a manufacturing method of a substrate including a process of planarizing with the abrasive compound. <P>SOLUTION: The abrasive compound is characterized by comprising (A) a compound containing three or more azole groups in molecule, (B) an oxidant, and (C) one or two or more compounds selected from among an amino acid, an organic acid, and an inorganic acid. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
