SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, METHOD OF PREPARING PATTERN THEREFOR, MANUFACTURING METHOD AND APPARATUS THEREOF, MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To effectively absorb power supply noise, to hereby realize stable operation of a circuit, and particularly to absorb noise existent in the close vicinity of a noise generation source. SOLUTION: In a semiconductor integrated circuit device, a bypass capacitor is not disposed in a vacant space after a layout design, but a trench T is formed in a required circuit block or in a nearby surface to form a trench type capacitor cell CD. Consequently, it is possible to effectively demonstrate the reduction of a chip area and noise reduction effect by the optimum disposition of the bypass capacitor. COPYRIGHT: (C)2006,JPO&NCIPI